FPC Prototype in Humanized Way

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Flex PCB Blog
Reflow Soldering PCB Temperature Curve Explanation
What is FPC
Special attention points for flexible circuit wiring
Multilayer PCB Stack-up Basics | PCB Knowledge
PCB Protection: Potting or Conformal Coating? | PCB Knowledge
FPCway: Specialized manufacturer of flexible printed circuit boards and rigid-flexible printed circuits
Future Trends of Flexible Circuit Boards
Rigid-Flex PCB Stack-up for Impedance Controlled Designs
Control Impedance Between Rigid PCB and Flex PCB
Flex PCB Reliability and Bendability
Normal Flex PCB Specifications
Flex PCB Polyimide Coverlay and Solder Mask
Flex PCB Boards and Connectors
About RA Copper and ED Copper
Introduction of Flexible PCB
5 Tips For Designing Flexible PCB
Advantages of FPC (Flexible PCB)
Evolution of the Flex Printed Circuit Board
Benefits of Using Flex Circuit Boards
Why Rigid-Flex PCBs are Economical?
Flexible PCB vs Rigid PCB
Development of Flexible printed circuit board (FPC) market
Traditional Manufacture Engineering of FPC Substrate
Development Trend of FPC Board
Flex PCB and the Manufacturing
About Flex PCB design
About Flex PCB and Assembly
How to Ensure Flex PCB Design Success
How to Select the Appropriate FPC Materials?
The Differences In Rigid PCB, Flex PCB and Rigid-Flex PCB
Flex-Rigid PCB Design Guidelines
Beneficials for Polyimide Flex PCB Boards
About Stiffener on Flex PCB FPC circuit Boards
About ENIG and ENEPIG
PCB Surface Finish Comparison
Copper Thickness for FPC Boards
Interconnect Solutions for Flexible Printed Circuits and Etched Foil Heaters
Advantages and Disadvantages of Rigid-Flex PCB
About FPC Plating Process
About EMI shield design for Flex Printed Circuit Board
PCB Assembly Blog
How to solve the problem of PCB warping deformation after welding large copper bar?
About PCB Assembly
QFP and BGA and the Development Trend in PCB assembly
Why some components need be baked before reflow soldering
About Flex PCB Assembly
Manual Soldering in SMT Assembly Manufacturing Process
BGA Components and BGA Assembly
Quick Understanding for PCB Assembly Process
About SMT Assembly (Surface Mount Technology)
About THT Assembly (Through-Hole Technology)
About Reflow Soldering
About_Wave_Soldering
PCB Assembly Inspections and Tests
Panel Requirements for PCB Assembly
About SMT (Surface Mount Technology)
FPC Research Blog
Preparation of FPC based on ultrasonic spraying method_4_Experimental Results
Preparation of FPC based on ultrasonic spraying method_3_Experimental Procedure
Preparation of FPC based on ultrasonic spraying method_2_Experimental Platform and Principle
Preparation of FPC based on ultrasonic spraying method_1_abstract
Research on Layout Design Method of Ultra-thin FPC_4_Analysis of Layout Design Methods
Research on Layout Design Method of Ultra-thin FPC_3_Analysis of Layout Design Methods
Research on Layout Design Method of Ultra-thin FPC_2_Analysis of Layout Design Methods
Research on Layout Design Method of Ultra-thin FPC_1_introduction
Research progress on polyimide FPC_2_the field of FPC
Research progress on polyimide FPC_1_Introduction
Analysis of Vibration Characteristics of FPCBs _4_Summary
Analysis of Vibration Characteristics of FPCBs _3_Finite Element Analysis
Analysis of Vibration Characteristics of FPCBs _2_Theory of Vibration Analysis
Analysis of Vibration Characteristics of FPCBs Under Random Vibration_1_Introduction
Design Methods for FPCBs_5_Practical Application
Design Methods for FPCBs_4_Electrical Circuit Design and Examples
Design Methods for FPCBs_3_Structure Design Method and Examples
Design Methods for FPCBs_2_Component Selection Methodology and Examples.
Research on Design Methods for FPCBs
Application of MPW technique for FPCBs _4_Summary
Application of MPW technique for FPCBs_3_Experimental results
Application of MPW technique for FPCBs_2_Experimental setup
Application of MPW technique for FPCBs_1_Principle of MPW
Application of FPCB in PC motherboards_4_ Results and discussion
Application of FPCB in PC motherboards_3_ Numerical analysis
Application of FPCB in PC_2_ Experimentation
Application of FPCB in PC motherboards
A Bus Planning Algorithm for FPC Design _4_Experimental result
A Bus Planning Algorithm for FPC Design _3_Proposed Algorithm
A Bus Planning Algorithm for FPC Design _2_Preliminaries
A Bus Planning Algorithm for FPC Design _1_Introduction

Research on Design Methods for FPC_1_Design Concept

 

1. Design Concept of Flexible Boards


The design of flexible boards consists of three parts: device selection, structural design, and electrical circuit design. If we compare a flexible board to a person, device selection is like the hands, feet, and eyes, serving as the interface between the flexible printed board and the external world, allowing it to interact with the outside environment; structural design is like the torso, providing strong support for the flexible printed board; and electrical circuit design is like the brain, embodying the soul of the flexible printed board. Although they have clear priorities, none of them can be dispensed with. They need to complement each other to complete the final flexible printed circuit board design, meeting requirements such as high speed, radio frequency assembly, and electrical performance.

 

1.1 Component Selection Requirements for Flexible Boards


As the gateway of flexible printed boards to the outside world, the component selection for flexible printed boards should meet the basic requirements for mating and docking with user system equipment. During the selection process, considerations should be given to the size, structure, and locking requirements of components from the perspectives of assembly, mating, locking, soldering, and routing, based on the locking method, mounting method, orientation, and limited structural space of the mating components on the user's system equipment.

 

1.2 Structural Design Requirements for Flexible Boards


The structural design of flexible printed circuit boards determines the space for electrical circuit design and also whether the physical structure of the product can meet the mechanical environmental requirements. As a solid foundation for flexible printed boards, the design process should consider requirements such as bending radius, fixing position, and non- routable space, and fully consider the physical reliability of flexible printed boards in the structural design process, taking into account the mechanical environmental requirements of the product application.

 

1.3 Electrical Circuit Design Requirements for Flexible Boards


The electrical circuit design of flexible printed circuit boards can be likened to the blood or soul of flexible printed circuit boards, and is the top priority in their design.

The basis for electrical circuit design of flexible printed circuit boards comes from the wiring relationship table and OJ 3103 - 99 "Printed Circuit Board Design Specification". Before starting the electrical circuit design, it is necessary to analyze the product's wiring relationships clearly, identifying which signals are present in the product's wiring table, whether they are digital or analog signals, differential signals, or power signals, etc., and understanding the requirements for each type of signal. Only by clarifying the characteristics of various signals can the true electrical performance requirements of the product be met.

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